Radiall USA, Inc. has launched a new range of cost effective board-to-board, module-to-module and panel-to-panel RF coaxial interconnect solutions developed for the telecommunications industry.

 

Radiall offers four different product groups and ten connector series including the new SMP-MAX, SMP-Spring, IMP-Spring and other misalignment solutions. These solutions address the most demanding wireless telecom applications required for the new generation of infrastructure compact equipment like base stations or handheld devices.

 

The new SMP-MAX large misalignment solution has a patented impedance matching insulator that is optimized for a larger operating gap between connectors. This makes it easier for engineers to handle a maximum board-to-board distance tolerance of up to .078" (2 mm) gap without a spring, which is 300 percent more than the standard SMP.

 

The new SMP-MAX features a 3 degree tilt (radial travel) and has an operating frequency range of DC-6 GHz, a 1.2 max VSWR guaranteed up to 3 GHz. In addition, it can handle up to 165 Watts of power at 3 GHz.

 

IMP-Spring, SMP-Spring and MMBX-Spring from Radiall are ideal spring-loaded solutions for both increased board-to-board distance misalignment tolerances of up to .078" (2 mm) and a tilt (radial travel) of up to 4.5 degrees.

 

The one IMP, three SMP and the MMBX limited misalignment series from Radiall are designed for applications that require relatively precise distance tolerance up to .023 (0.6mm) with a tilt of (radial travel) up to 4.5 degrees.