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ACCESS and Telechips Showcase World's First Android HbbTV STB SoC at CESACCESS CO., LTD, a global provider of advanced software technologies to the automotive, mobile, Internet of Things (IoT) and digital TV markets, and, Telechips, a global fabless semiconductor company, which designs semiconductor solutions for CE (STB & OTT), automotive, and IoT businesses, today announced that they will host joint demonstrations at Telechips' CES (News - Alert) suite at the Palazzo Resort Hotel. The solution showcased in the suite will enable operators to discover how they can utilize HbbTV running on an Android (News - Alert) hybrid TV to deliver high quality content to Android users without compromising on security. "Broadcasters and operators are increasingly looking for cost-effective solutions that will enable them to extend their TV services with applications, OTT and hybrid services," said Dr. Neale Foster, COO and VP Global Sales, ACCESS Europe. "Collaborating with Telechips enables us to show operators attending CES that they can easily deploy HbbTV based services on Android based STBs." The set-top-box reference design solution demoed in the Telechips suite at CES relies on the Telechips' TCC8970 System on Chip (SoC), which is ideally suited for cost-effective multimedia devices such as smart sticks, IP-clients, OTT, IPTV (News - Alert) and car audio displays. Supporting HEVC, the SoC also enables operators to deliver high quality content, while the ACCESS NetFront™ NX Browser ensures compatibility with European TV standards such as HbbTV 1.5. Commenting on the partnership, Andrew Yong-kwon Lee, marketing VP of Telechips, explained: "At CES, we will reveal the world's first Android HbbTV TV based on our TCC8970 chipset and ACCESS software, which will enable worldwide satellite operators to offer IP-based interactive TV services in 2016. Collaborating with the industry expert ACCESS enables us to deliver HbbTV middleware to our SoC solution, allowing us to make one-way satellite TV interactive. The solution also supports embedded Conditional Access, ensuring that it meets the high-level security requirements of the content industry." The TCC8970 chipsets, at the core of the solution, include the following key features:
Note to editors: If you would like to make an appointment to meet ACCESS at CES, please contact Segolene Roche, [email protected], +44 207 486 4900. About ACCESS Since 1984, ACCESS CO., LTD. (Tokyo Stock Exchange Mothers Index, 4813) has provided advanced IT solutions centered around mobile and network software technologies to telecom carriers, consumer electronics manufacturers, broadcasting and publishing companies, the automotive industry and energy infrastructure providers around the world. The company develops mobile software solutions that have been installed on over 1.5 billion devices, and network software solutions that have been used by over 300 telecommunication equipment manufacturers. Utilizing its network virtualization technology skills and knowledge, the company is currently focusing on the development and commercialization of Internet of Things (IoT) and media solutions that combine embedded and cloud technology. Headquartered in Tokyo, Japan, the company operates subsidiaries and affiliates in Asia, Europe and the United States to support and expand its business globally. Learn more about ACCESS at www.access-company.com. About Telechips Telechips Inc. is a global fabless semiconductor company headquartered in Korea, which designs semiconductor solutions for CE (STB & OTT), Automotive, and IoT business. Its products range from application processors and modules such as Wifi, Bluetooth and GPS. Telechips always does the best effort to go a step ahead of the market trend and provide customers with leading & competitive solutions. For more information, please visit http://www.telechips.com. © 2016 ACCESS CO., LTD. All rights reserved. ACCESS, the ACCESS logo, and NetFront are registered trademarks or trademarks of ACCESS CO., LTD. in the United States, Japan and/or other countries. All other trademarks, logos and trade names mentioned in the document are the property of their respective owners. View source version on businesswire.com: http://www.businesswire.com/news/home/20160106005557/en/ |
